Rigaku XRTmicron is a fast, high-resolution laboratory X-ray topographic system for non-destructive analysis of dislocations. Various types of dislocations and inhomogeneities in single crystal wafers (such as Si, SiC, GaN, Ge, GaAs, quartz, sapphire, rutile, calcium fluoride, etc.) can be imaged on wafers up to 300 mm in diameter.
Features
High brightness dual wavelength X-ray source: MicroMax-007 DW High-resolution CCD camera: XTOP (5.4 µm pixels) Ultra high resolution CCD camera: HR-XTOP (2.4 µm pixels) Horizontal sample holder minimizes wafer artifacts Automatic wafer curvature correction for best dislocation image quality Automated system operation, including X-ray anode switch, detector switch, optical switch and alignment, sample alignment and image collection Automatic dislocation analysis Supports 3, 4, 6, 8, and 12-inch wafers Compatible with wafer loaders