Study of the resistance to oxidation in copper alloys by Thermal Gravimetric Analysis (TGA) (CAT#: STEM-ACT-0033-WXH)

Introduction

Oxidation of pure copper at elevated temperatures leads to formation of copper oxides with various appearance. It was found that the temperatures over 500 °C provide even, black surface, which is result of formation of copper (I) oxide Cu2O.<br />Copper alloys are metal alloys that have copper as their principal component. They have high resistance against corrosion.

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Principle Applications Procedure Materials Notes Related Products

Principle

Thermogravimetric analysis or thermal gravimetric analysis (TGA) is a method of thermal analysis in which the mass of a sample is measured over time as the temperature changes. This measurement provides information about physical phenomena, such as phase transitions, absorption, adsorption and desorption; as well as chemical phenomena including chemisorptions, thermal decomposition, and solid-gas reactions (e.g., oxidation or reduction).

Applications

• Thermal characterization of polymers.
• Determination of the composition of alloys and mixtures.
• Determining the purity and thermal stability of both primary and secondary standards.

Procedure

TGA analysis is performed by gradually raising the temperature of a sample in a furnace as weight is measured on an analytical balance that remains outside the furnace. Thermogravimetric analysis instrument measures the changes in a sample's weight in a particular temperature by enclosing the sample in an oven.

Materials

Thermogravimetric analyzer

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